As surface decoration demands intensify, manufacturers face critical gaps in achieving durable metallic finishes on diverse substrates. Traditional "gold powder" shortcuts compromise authenticity, while conventional hot stamping fails on complex geometries. Enter UV DTF’s engineered solutions—delivering authentic, high-adhesion metallic finishes without compromise.
System 1: Precision Varnish Layering Technology
This advanced approach leverages dual-curing chemistry:
Primary varnish constructs dimensional foundations
Exclusive metallic-adhesion varnish creates bonding surfaces
Precision stripping films enable micron-level detailing
Critical Implementation Notes:
Industrial-grade piezoelectric printheads mandatory
Dedicated transfer films prevent cross-contamination
Dual-printhead configurations recommended (e.g., 2x Epson F1080)
System 2: Unified Adhesive Integration
A revolutionary single-step methodology combining:
CMYK + White + Multi-functional adhesive channels
Glue-free specialty films for residue-free transfer
Quad-printhead synchronization capability
Operational Advantages:
Eliminates secondary processing
Enables 3D metallic textures
Compatible with curved/irregular surfaces
Parameter | System 1 | System 2 |
---|---|---|
Print Heads | 2x Industrial | 4x Synchronized |
UV Curing | ≥360W/cm² LED | ≥400W/cm² LED |
Material Throughput | 22 m²/hr | 18 m²/hr |
Min. Detail | 0.3mm | 0.15mm |
Luxury Packaging: 98% adhesion on textured leathers
Electronics: Survives 200+ thermal shock cycles (-40°C↔150°C)
Textile Tags: 40% lighter than traditional metal badges
Cosmetics: Mirror-finish metallics on acrylic tubes
*Independent testing showed 300% stronger metallic adhesion versus gold-powder alternatives.*
Nano-Metallic Inks: Sub-micron metallic particles
Dynamic Curing: Region-specific adhesion control
ECO Series: Compostable metallic transfer films
Hybrid Effects: Holographic + Gold combos
Unlock Your Golden Edge
» Request Butterfly Process Video Demonstration
» Download Technical Specification Dossier
» Schedule Free Substrate Compatibility Test